Capabilities Index / 2026
Six capability areas, one supply chain: from rapid-turn prototype to certified 50,000-unit production.
Noora Electronics manufactures high-reliability PCBs, calibrated sensor modules, and embedded control boards for industrial OEMs building IoT, automation, and edge-AI products. Every capability below ships with full traceability, IPC-A-610 Class 3 certification, and a 5-year warranty backed by our in-house NPI lab.
- 12,400+
- units shipped in 2024 with a verified first-pass yield of 98.7%
Technical Index
Six capability areas. Each links to its spec table, datasheet, and case studies.
A scannable table of contents for engineering evaluation. Jump directly to PCB assembly, sensor modules, embedded control boards, rapid-turn prototyping, EMC pre-compliance, or the in-house NPI lab.
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01
Specs →
PCB Assembly
Up to 12 layers, 01005 component support, two SMT lines at 120,000 CPH. IPC-A-610 Class 3 certified.
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02
Specs →
Sensor Modules
Pre-integrated, calibrated modules for temperature, pressure, current, vibration, and environmental sensing.
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03
Specs →
Embedded Control Boards
Production-ready carrier boards for industrial compute, real-time control, and edge-AI workloads.
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04
Specs →
Rapid-Turn Prototyping
72-hour turn on boards up to 12 layers, with a named principal engineer reviewing every DFM.
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05
Specs →
EMC Pre-Compliance
In-house chamber; 80% of clients clear CE/FCC on the first external attempt.
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06
Specs →
In-House NPI Lab
3D X-ray, flying-probe ICT, 4-axis BGA rework, and lifetime DFM reviews.
Capability 01 · PCB Assembly
PCB assembly: up to 12 layers, 01005 support, 120,000 CPH.
Noora runs two surface-mount lines capable of 120,000 component placements per hour with 01005 component support, hand-placed BGA and QFN packages, and full AOI + X-ray inspection on every build. Every PCB assembly job ships with lot-level traceability and IPC-A-610 Class 3 acceptance.
Datasheet — PCB Assembly
| Layer count | 1 to 12 layers (rigid); 4–8 layer rigid-flex on request |
|---|---|
| Board thickness | 0.4 mm to 3.2 mm |
| Min component size | 01005 imperial (0.4 × 0.2 mm) |
| Max component size | 55 mm (connectors, transformers) |
| BGA / QFN support | 0.3 mm pitch BGA; QFN down to 0.4 mm pitch |
| SMT throughput | 120,000 CPH across two lines |
| Solder processes | SAC305 lead-free reflow; selective solder for through-hole |
| Inspection | 3D AOI (post-reflow); 3D X-ray (BGA & QFN); flying-probe ICT |
| Acceptance standard | IPC-A-610 Class 3 (since 2017, zero major non-conformances in 28 mo.) |
| Component sourcing | 41 franchised distributors; counterfeit-risk screening on every lot |
| Typical lot size | 50 (NPI) to 50,000 units |
| Warranty | 5 years, backed by in-house NPI lab |
Related case studies
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Industrial Gateway · 8,200 units
12-layer IoT gateway with 01005 power section
First-pass yield 99.1% across an 8,200-unit run; thermal-management layout cut power loss by 31% versus the client's reference design.
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Medical Pump Controller · 1,400 units
Class III medical pump controller board
ISO 13485 build with full lot traceability; passed FDA submission audit on first review with zero documentation findings.
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Aerospace Sensor Hub · 620 units
AS9100D sensor hub for flight-data telemetry
Six-layer rigid-flex assembly; 4-axis BGA rework applied to two prototype units prior to flight qualification.
Capability 02 · Sensor Modules
Sensor modules: calibrated, pre-integrated, drop-in for industrial systems.
Noora designs and manufactures calibrated sensor modules for temperature, pressure, current, vibration, humidity, and multi-gas detection. Each module ships factory-calibrated with NIST-traceable certificates, documented accuracy, and an environmental rating that an engineer can copy straight into a system spec.
Datasheet — Sensor Modules
| Module types | Temperature, pressure, current (AC/DC), vibration, humidity, multi-gas (CH₄, CO, VOC) |
|---|---|
| Signal outputs | 4–20 mA, 0–10 V, RS-485 / Modbus RTU, CAN 2.0B, I²C, SPI |
| Accuracy | ±0.1 °C (temperature); ±0.05% FS (pressure); ±0.2% (current shunt) |
| Calibration | Factory-calibrated; NIST-traceable certificate shipped per unit |
| Operating temp. | −40 °C to +85 °C standard; −55 °C to +125 °C on request |
| Ingress protection | IP65, IP67, IP68 depending on housing |
| Housing options | PBT, anodized aluminum, stainless 316L |
| Connectors | M12 A-coded, M12 D-coded, M8, flying lead |
| EMC | EN 61000-6-2 / EN 61000-6-4 pre-compliance verified in-house |
| Traceability | Per-unit serial; calibration certificate & test report archived 10 years |
Related case studies
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Process Manufacturing · 4,200 modules
4–20 mA pressure module for chemical dosing skid
Drop-in replacement for a discontinued competitor part; −40 °C to +85 °C with IP67 housing, calibrated to ±0.05% FS.
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Vibration Monitoring · 2,800 modules
RS-485 vibration module for predictive maintenance
Modbus RTU output at 1 kS/s per axis; deployed on rotating equipment in food-processing plants.
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Substation Monitoring · 1,100 modules
Split-core current module for retrofit switchgear
Class 0.5 metering accuracy; stainless 316L housing; UL-listed per IEC 61010-1 for substation retrofit work.
Capability 03 · Embedded Control Boards
Embedded control boards: production-ready carriers for industrial compute and edge AI.
Noora designs and builds embedded control boards for industrial compute, real-time control, and edge-AI workloads. Supported silicon spans the major MCU and SoC families, with named-program partnerships on NVIDIA Jetson-based platforms and a maintained BSP for each shipping product.
Datasheet — Embedded Control Boards
| MCU families | STMicro STM32 (F4/F7/H7/MP1), NXP i.MX RT & i.MX 8M, Renesas RA & RZ, ESP32-S3 |
|---|---|
| Edge-AI silicon | NVIDIA Jetson Orin Nano / NX; named partner on 9 Jetson programs (2024–2025) |
| OS / BSP | Yocto, Buildroot, Ubuntu LTS, OpenWrt; signed BSP image per SKU |
| RTOS support | FreeRTOS, Zephyr, ThreadX |
| I/O density | Up to 4× GbE, 2× USB 3.0, 2× CAN-FD, 6× UART, 4× SPI, 2× I²C, M.2 NVMe |
| Industrial buses | Modbus RTU/TCP, EtherCAT, PROFINET, EtherNet/IP |
| Security | Secure boot, TPM 2.0 (optional), encrypted OTA |
| Operating temp. | −40 °C to +85 °C industrial; −25 °C to +75 °C for Jetson SKUs |
| Lifecycle | 10-year component longevity on every shipping board |
| Certifications | CE, FCC, UL 60950-1 / UL 62368-1, RoHS 3 |
Related case studies
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Edge AI · 720 units
Jetson Orin Nano carrier for vision-guided robotics
Custom carrier with 4× GbE PoE+ for camera arrays; validated to +75 °C continuous operation in a factory cell.
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Substation Controller · 1,650 units
IEC 61850 station controller on NXP i.MX 8M Plus
Dual-Ethernet PRP, hardware timestamping, KEMA-certified TypeTest report delivered with the BOM.
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Fleet Telematics · 9,500 units
STM32H7 telematics ECU with CAN-FD and LTE Cat-M
10-year lifecycle bill of materials; deployed across 9,500 heavy-duty vehicles across North America.
By the Numbers · 2024–2026
The hard evidence behind every capability on this page.
Every metric below is verifiable from third-party AOI audits, customer-survey data, or certifications on file. Numbers that engineering buyers most often cite in supplier-qualification reviews.
- 98.7%
- First-pass yield across 12,400+ units shipped in 2024, verified by third-party AOI audits.
- 99.2%
- On-time delivery across the last 24 months of production runs.
- 9 yrs
- Continuously certified to IPC-A-610 Class 3 and AS9100D since 2017, with zero major non-conformances in 28 months.
- 38
- Countries shipped across six continents as of Q1 2026.
- 120k
- Component placements per hour across two SMT lines, with 01005 component support.
- 14 yrs
- Average tenure of DFM-review engineers — the people reviewing your design before the first unit is built.